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Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
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Authors
Spessot, Alessio
;
Salahuddin, Shairfe Muhammad
;
Escobar Gavilanez, Ricardo
;
Ritzenthaler, Romain
;
Xiang, Yang
;
Budhwani, Rahul Kumar
;
Dentoni Litta, Eugenio
;
Capogreco, Elena
;
Bastos, Joao
;
Chen, Yangyin
;
Horiguchi, Naoto
DOI
10.1109/IMW52921.2022.9779308
EISBN
978-1-6654-9947-7
ISSN
2330-7978
Conference
14th IEEE International Memory Workshop (IMW)
Journal
na
Title
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
Publication type
Proceedings paper
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Conference contributions
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Date
Summary
2
20.500.12860/40643.2
*
2023-06-13T09:59:54Z
validation by library/open access desk
1
20.500.12860/40643
2022-10-30T02:55:00Z
*Selected version
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