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dc.contributor.authorSpessot, Alessio
dc.contributor.authorSalahuddin, Shairfe Muhammad
dc.contributor.authorEscobar, Ricardo
dc.contributor.authorRitzenthaler, Romain
dc.contributor.authorXiang, Yang
dc.contributor.authorBudhwani, Rahul
dc.contributor.authorLitta, Eugenio Dentoni
dc.contributor.authorCapogreco, Elena
dc.contributor.authorBastos, Joao
dc.contributor.authorChen, Yangyin
dc.contributor.authorNaoto, Horiguchi
dc.date.accessioned2022-10-30T02:55:00Z
dc.date.available2022-10-30T02:55:00Z
dc.date.issued2022
dc.identifier.issn2330-7978
dc.identifier.otherWOS:000869001800038
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40643
dc.sourceWOS
dc.titleThermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
dc.typeProceedings paper
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorSalahuddin, Shairfe Muhammad
dc.contributor.imecauthorEscobar, Ricardo
dc.contributor.imecauthorRitzenthaler, Romain
dc.contributor.imecauthorXiang, Yang
dc.contributor.imecauthorBudhwani, Rahul
dc.contributor.imecauthorLitta, Eugenio Dentoni
dc.contributor.imecauthorCapogreco, Elena
dc.contributor.imecauthorBastos, Joao
dc.contributor.imecauthorChen, Yangyin
dc.contributor.imecauthorNaoto, Horiguchi
dc.contributor.orcidimecSalahuddin, Shairfe Muhammad::0000-0002-6483-8430
dc.contributor.orcidimecRitzenthaler, Romain::0000-0002-8615-3272
dc.contributor.orcidimecXiang, Yang::0000-0003-0091-6935
dc.contributor.orcidimecBastos, Joao::0000-0002-8877-9850
dc.identifier.doi10.1109/IMW52921.2022.9779308
dc.identifier.eisbn978-1-6654-9947-7
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.beginpage148
dc.source.endpage151
dc.source.conference14th IEEE International Memory Workshop (IMW)
dc.source.conferencedateMAR 15-18, 2022
dc.source.conferencelocationDresden
imec.availabilityUnder review


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