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Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks

dc.contributor.authorBeerten, Steven
dc.contributor.authorLabie, Riet
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorHonoré, Mia
dc.date.accessioned2021-10-14T12:40:34Z
dc.date.available2021-10-14T12:40:34Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4106
dc.sourceIIOimport
dc.titleFlip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage41
dc.source.endpage44
dc.source.conferenceIMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings
dc.source.conferencedate18/06/2000
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - open access


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