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Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress

dc.contributor.authorLee, Kookjin
dc.contributor.authorKaczer, Ben
dc.contributor.authorKruv, Anastasiia
dc.contributor.authorGonzalez, Mario
dc.contributor.authorEneman, Geert
dc.contributor.authorOkudur, Oguzhan Orkut
dc.contributor.authorGrill, Alexander
dc.contributor.authorFranco, Jacopo
dc.contributor.authorVici, Andrea
dc.contributor.authorDegraeve, Robin
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2023-06-08T13:28:00Z
dc.date.available2023-02-27T03:28:18Z
dc.date.available2023-06-08T13:28:00Z
dc.date.issued2022
dc.identifier.issn1541-7026
dc.identifier.otherWOS:000922926400113
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41173.2
dc.sourceWOS
dc.titleSignificant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress
dc.typeProceedings paper
dc.contributor.imecauthorLee, Kookjin
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorKruv, Anastasiia
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorOkudur, Oguzhan Orkut
dc.contributor.imecauthorGrill, Alexander
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorVici, Andrea
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecLee, Kookjin::0000-0002-9896-1090
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecOkudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimecGrill, Alexander::0000-0003-1615-1033
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.identifier.doi10.1109/IRPS48227.2022.9764540
dc.identifier.eisbn978-1-6654-7950-9
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.conferenceIEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 27-31, 2022
dc.source.conferencelocationDallas
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/41173.2*2023-06-08T13:27:10Zvalidation by library/open access desk
120.500.12860/411732023-02-27T03:28:18Z

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