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High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)
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Authors
Beyne, Eric
;
Van Hoof, Rita
;
Webers, Tomas
;
Rossi, S.
;
Lechleiter, F.
;
Di Ianni, M.
;
Ostmann, A.
Conference
Proceedings 2000 International Symposium on Microelectronics
Title
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)
Publication type
Proceedings paper
Embargo date
9999-12-31
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