dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Van Hoof, Rita | |
dc.contributor.author | Webers, Tomas | |
dc.contributor.author | Rossi, S. | |
dc.contributor.author | Lechleiter, F. | |
dc.contributor.author | Di Ianni, M. | |
dc.contributor.author | Ostmann, A. | |
dc.date.accessioned | 2021-10-14T12:41:00Z | |
dc.date.available | 2021-10-14T12:41:00Z | |
dc.date.issued | 2000 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4120 | |
dc.source | IIOimport | |
dc.title | High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD) | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Van Hoof, Rita | |
dc.contributor.imecauthor | Webers, Tomas | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 229 | |
dc.source.endpage | 234 | |
dc.source.conference | Proceedings 2000 International Symposium on Microelectronics | |
dc.source.conferencedate | 18/09/2000 | |
dc.source.conferencelocation | Boston, MA USA | |
imec.availability | Published - open access | |