dc.contributor.author | Le Tulzo, Harold | |
dc.contributor.author | Celeste, Loriana | |
dc.contributor.author | Tendero, Ines | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Gerets, Carine | |
dc.contributor.author | Thomas, Candice | |
dc.contributor.author | Charbonnier, Jean | |
dc.contributor.author | Deschaseaux, Edouard | |
dc.contributor.author | Lazerand, Thierry | |
dc.contributor.author | Daviot, Jerome | |
dc.date.accessioned | 2023-09-22T10:32:16Z | |
dc.date.available | 2023-06-04T20:11:49Z | |
dc.date.available | 2023-06-08T06:48:43Z | |
dc.date.available | 2023-09-22T10:32:16Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0167-9317 | |
dc.identifier.other | WOS:000989687200001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41687.3 | |
dc.source | WOS | |
dc.title | Developing TSV wet cleaning chemistry for quantum computing application | |
dc.type | Journal article | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Gerets, Carine | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | Gerets, Carine::0009-0007-2069-6032 | |
dc.date.embargo | 2025-05-01 | |
dc.identifier.doi | 10.1016/j.mee.2023.112010 | |
dc.source.numberofpages | 10 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 73 | |
dc.source.endpage | 83 | |
dc.source.journal | MICROELECTRONIC ENGINEERING | |
dc.source.issue | Art. 112010 | |
dc.source.volume | 276 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | This project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union's Horizon 2020 research and innovation program and Germany, France, Belgium, Austria, Netherlands, Finland, Israel. (Please visit the project website www.matqu.eu for more information). The authors would like to thank Diane BIJOU and Samir SAFI from Technic France for fruitful discussions. For EDS analyses, a special thank is addressed to Maximilien COTTAT from PlasmaTherm. | |