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New bending mode in SAQP Si fins and its mitigation
dc.contributor.author | Sepulveda, Alfonso | |
dc.contributor.author | Hellin, David | |
dc.contributor.author | Zhang, Liping | |
dc.contributor.author | Kenis, Karine | |
dc.contributor.author | Batuk, Dmitry | |
dc.contributor.author | Baudot, Sylvain | |
dc.contributor.author | Briggs, Basoene | |
dc.contributor.author | Mountsier, Tom | |
dc.contributor.author | Barla, Kathy | |
dc.contributor.author | Morin, Pierre | |
dc.contributor.author | Sanchez, Efrain Altamirano | |
dc.date.accessioned | 2023-06-20T10:34:30Z | |
dc.date.available | 2023-06-20T10:34:30Z | |
dc.date.issued | 2022-APR | |
dc.identifier.issn | 1369-8001 | |
dc.identifier.other | WOS:000788064600005 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41852 | |
dc.source | WOS | |
dc.title | New bending mode in SAQP Si fins and its mitigation | |
dc.type | Journal article | |
dc.contributor.imecauthor | Sepulveda, Alfonso | |
dc.contributor.imecauthor | Zhang, Liping | |
dc.contributor.imecauthor | Kenis, Karine | |
dc.contributor.imecauthor | Batuk, Dmitry | |
dc.contributor.imecauthor | Baudot, Sylvain | |
dc.contributor.imecauthor | Briggs, Basoene | |
dc.contributor.imecauthor | Barla, Kathy | |
dc.contributor.imecauthor | Morin, Pierre | |
dc.contributor.imecauthor | Sanchez, Efrain Altamirano | |
dc.contributor.orcidimec | Zhang, Liping::0000-0002-2947-8660 | |
dc.contributor.orcidimec | Sanchez, Efrain Altamirano::0000-0003-3235-6055 | |
dc.contributor.orcidimec | Batuk, Dmitry::0000-0002-6384-6690 | |
dc.contributor.orcidimec | Morin, Pierre::0000-0002-4637-496X | |
dc.identifier.doi | 10.1016/j.mssp.2021.106437 | |
dc.source.numberofpages | 8 | |
dc.source.peerreview | yes | |
dc.source.journal | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING | |
dc.source.volume | 141 | |
imec.availability | Under review |
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