Publication:

A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication

Date

2022

Journal article

https://doi.org/10.1016/j.mee.2021.111660

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Author(s)

Kruv, Anastasiia

;

Gonzalez, Mario

;

Okudur, Oguzhan Orkut

;

Spampinato, Valentina

;

Franquet, Alexis

;

Vadakupudhu Palayam, Senthil

;

Arreghini, Antonio

;

Van den Bosch, Geert

;

Rosmeulen, Maarten

;

De Wolf, Ingrid

Journal

MICROELECTRONIC ENGINEERING

Metrics

1458 since deposited on 2023-06-20

5last month

Acq. date: 2026-01-07