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Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication
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Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication
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Date
2023
Journal article
https://doi.org/10.1016/j.microrel.2023.114996
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Okudur, Oguzhan Orkut
;
Gonzalez, Mario
;
Van den Bosch, Geert
;
Rosmeulen, Maarten
Journal
MICROELECTRONICS RELIABILITY
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1125
since deposited on 2023-06-25
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Acq. date: 2026-01-07
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Metrics
Views
1125
since deposited on 2023-06-25
2
last month
Acq. date: 2026-01-07
Citations