Publication:

Impact of via geometry and line extension on via-electromigration in nano-interconnects

Date

2023

Proceedings Paper

https://doi.org/10.1109/IRPS48203.2023.10118027

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Author(s)

;

Zahedmanesh, Houman

;

;

De Wolf, Ingrid

;

Journal

N/A

Statistics

790 since deposited on 2023-07-15

Acq. date: 2026-02-27