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dc.contributor.authorHwang, MinJin
dc.contributor.authorDey, Bappaditya
dc.contributor.authorDehaerne, Enrique
dc.contributor.authorHalder, Sandip
dc.contributor.authorShin, Young-Han
dc.date.accessioned2023-07-28T17:39:47Z
dc.date.available2023-07-28T17:39:47Z
dc.date.issued2023
dc.identifier.isbn978-1-5106-6099-1
dc.identifier.issn0277-786X
dc.identifier.otherWOS:001022962000004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42230
dc.sourceWOS
dc.titleSEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering
dc.typeProceedings paper
dc.contributor.imecauthorHwang, MinJin
dc.contributor.imecauthorDey, Bappaditya
dc.contributor.imecauthorDehaerne, Enrique
dc.contributor.imecauthorHalder, Sandip
dc.contributor.orcidimecDey, Bappaditya::0000-0002-0886-137X
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.identifier.doi10.1117/12.2657555
dc.identifier.eisbn978-1-5106-6100-4
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.conferenceConference on Metrology, Inspection, and Process Control XXXVII
dc.source.conferencedateFEB 27-MAR 02, 2023
dc.source.conferencelocationSan Jose
dc.source.volume12496
imec.availabilityUnder review


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