dc.contributor.author | Ciesielski, Richard | |
dc.contributor.author | Lohr, Leonhard M. | |
dc.contributor.author | Mertens, Hans | |
dc.contributor.author | Charley, Anne-Laure | |
dc.contributor.author | de Ruyter, Rudi | |
dc.contributor.author | Bogdanowicz, Janusz | |
dc.contributor.author | Hoenicke, Philipp | |
dc.contributor.author | Abbasirad, Najmeh | |
dc.contributor.author | Soltwisch, Victor | |
dc.date.accessioned | 2024-04-11T10:17:28Z | |
dc.date.available | 2023-07-28T17:39:56Z | |
dc.date.available | 2024-04-11T10:17:28Z | |
dc.date.issued | 2023 | |
dc.identifier.isbn | 978-1-5106-6099-1 | |
dc.identifier.issn | 0277-786X | |
dc.identifier.other | WOS:001022962000048 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42235.2 | |
dc.source | WOS | |
dc.title | Pushing the boundaries of EUV scatterometry: reconstruction of complex nanostructures for next-generation transistor technology | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Mertens, Hans | |
dc.contributor.imecauthor | Charley, Anne-Laure | |
dc.contributor.imecauthor | de Ruyter, Rudi | |
dc.contributor.imecauthor | Bogdanowicz, Janusz | |
dc.contributor.orcidimec | Charley, Anne-Laure::0000-0003-4745-0167 | |
dc.contributor.orcidimec | De Ruyter, Rudi::0000-0002-8145-288X | |
dc.contributor.orcidimec | Bogdanowicz, Janusz::0000-0002-7503-8922 | |
dc.contributor.orcidimec | Mertens, Hans::0000-0002-3392-6892 | |
dc.identifier.doi | 10.1117/12.2658501 | |
dc.identifier.eisbn | 978-1-5106-6100-4 | |
dc.source.numberofpages | 9 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 124961M | |
dc.source.conference | Conference on Metrology, Inspection, and Process Control XXXVII | |
dc.source.conferencedate | FEB 27-MAR 02, 2023 | |
dc.source.conferencelocation | San Jose | |
dc.source.journal | Proceedings of SPIE | |
dc.source.volume | 12496 | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The authors acknowledge that this project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement 826589 - MADEin4 and grand agreement 875999 - IT2. This Joint Undertaking receives support from the European Union's Horizon 2020 research and innovation program alongside Netherlands, France, Belgium, Germany, Czech Republic, Austria, Hungary and Israel. | |