dc.contributor.author | Naeim, Mohamed | |
dc.contributor.author | Yang, Hanqi | |
dc.contributor.author | Chen, Pinhong | |
dc.contributor.author | Bao, Rong | |
dc.contributor.author | Dekeyser, Antoine | |
dc.contributor.author | Sisto, Giuliano | |
dc.contributor.author | Brunion, Moritz | |
dc.contributor.author | Chen, Rongmei | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Milojevic, Dragomir | |
dc.date.accessioned | 2024-03-25T12:54:18Z | |
dc.date.available | 2023-08-10T17:37:00Z | |
dc.date.available | 2024-03-25T12:54:18Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 2164-0157 | |
dc.identifier.other | WOS:001021364700038 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42309.3 | |
dc.source | WOS | |
dc.title | Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Naeim, Mohamed | |
dc.contributor.imecauthor | Sisto, Giuliano | |
dc.contributor.imecauthor | Brunion, Moritz | |
dc.contributor.imecauthor | Chen, Rongmei | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Milojevic, Dragomir | |
dc.contributor.orcidimec | Sisto, Giuliano::0000-0001-8706-4311 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Brunion, Moritz::0000-0001-7842-7774 | |
dc.identifier.doi | 10.1109/3DIC57175.2023.10155075 | |
dc.identifier.eisbn | 979-8-3503-1137-2 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International 3D Systems Integration Conference (3DIC) | |
dc.source.conferencedate | MAY 10-12, 2023 | |
dc.source.conferencelocation | Cork | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |