Publication:

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs

Date

2023

Proceedings Paper

https://doi.org/10.1109/3DIC57175.2023.10155075

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Author(s)

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Dekeyser, Antoine

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Sisto, Giuliano

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Brunion, Moritz

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Van der Plas, Geert

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Milojevic, Dragomir

Journal

N/A

Statistics

904 since deposited on 2023-08-10

Acq. date: 2026-02-04