Publication:

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs

Date

2023
Proceedings Paper
https://doi.org/10.1109/3DIC57175.2023.10155075
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dc.contributor.authorNaeim, Mohamed
dc.contributor.authorYang, Hanqi
dc.contributor.authorChen, Pinhong
dc.contributor.authorBao, Rong
dc.contributor.authorDekeyser, Antoine
dc.contributor.authorSisto, Giuliano
dc.contributor.authorBrunion, Moritz
dc.contributor.authorChen, Rongmei
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorMilojevic, Dragomir
dc.contributor.imecauthorNaeim, Mohamed
dc.contributor.imecauthorSisto, Giuliano
dc.contributor.imecauthorBrunion, Moritz
dc.contributor.imecauthorChen, Rongmei
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.orcidimecSisto, Giuliano::0000-0001-8706-4311
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecBrunion, Moritz::0000-0001-7842-7774
dc.date.accessioned2024-03-25T12:54:18Z
dc.date.available2023-08-10T17:37:00Z
dc.date.available2024-03-25T12:54:18Z
dc.date.issued2023
dc.identifier.doi10.1109/3DIC57175.2023.10155075
dc.identifier.eisbn979-8-3503-1137-2
dc.identifier.issn2164-0157
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42309
dc.publisherIEEE
dc.source.conferenceIEEE International 3D Systems Integration Conference (3DIC)
dc.source.conferencedateMAY 10-12, 2023
dc.source.conferencelocationCork
dc.source.journalN/A
dc.source.numberofpages4
dc.title

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs

dc.typeProceedings paper
dspace.entity.typePublication
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