Publication:

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs

Date

2023

Proceedings Paper

https://doi.org/10.1109/3DIC57175.2023.10155075

Simple item page Full metadata Statistics

Author(s)

;

;

;

;

Dekeyser, Antoine

;

Sisto, Giuliano

;

Brunion, Moritz

;

;

Van der Plas, Geert

;

;

Milojevic, Dragomir

Journal

N/A

Statistics

905 since deposited on 2023-08-10

Acq. date: 2026-03-16