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NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips
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NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips
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Date
2023
Proceedings Paper
https://doi.org/10.23919/DATE56975.2023.10136952
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Iturbe, Xabier
;
Abderrahmane, Nassim
;
Abella, Jaume
;
Alcaide, Sergi
;
Beyne, Eric
;
Charles, Henri-Pierre
;
Charpin-Nicolle, Christelle
;
Chittka, Lars
;
Davila, Angelica
;
Erdmann, Arne
;
Estrada, Carles
;
Fernandez, Ander
;
Fontanelli, Anna
;
Flich, Jose
;
Furano, Gianluca
;
Gloriani, Alejandro Hernan
;
Isusquiza, Erik
;
Grosu, Radu
;
Hernandez, Carles
;
Ielmini, Daniele
;
Jackson, David
;
Kooli, Maha
;
Lepri, Nicola
;
Linares-Barranco, Bernabe
;
Lachese, Jean-Loup
;
Laurent, Eric
;
Lindwer, Menno
;
Linsenmaier, Frank
;
Lujan, Mikel
;
Masarik, Karel
;
Mentens, Nele
;
Moreira, Orlando
;
Nawghane, Chinmay
;
Peres, Luca
;
Noel, Jean-Philippe
;
Pourtaherian, Arash
;
Posch, Christoph
;
Priller, Peter
;
Prikryl, Zdenek
;
Resch, Felix
;
Rhodes, Oliver
;
Stefanov, Todor
;
Störring, Moritz
;
Taliercio, Michele
;
Tornero, Rafael
;
van de Burgwal, Marcel
;
van der Plas, Geert
;
Vianello, Elisa
;
Zaykov, Pavel
Journal
N/A
Abstract
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Acq. date: 2025-12-10
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Views
760
since deposited on 2023-08-19
1
last month
1
last week
Acq. date: 2025-12-10
Citations