Hermetically sealed on-chip packaging of MEMS devices

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Authors
De Moor, Piet; Tilmans, Harrie; Van De Peer, Myriam; Labie, Riet; Beerten, Steven; Beyne, Eric; Van Hoof, Chris
Conference
Proceedings European Space Components Conference - ESCCON
Title
Hermetically sealed on-chip packaging of MEMS devices
Publication type
Proceedings paper
Embargo date
9999-12-31
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