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Hermetically sealed on-chip packaging of MEMS devices

dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorLabie, Riet
dc.contributor.authorBeerten, Steven
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-14T12:49:10Z
dc.date.available2021-10-14T12:49:10Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4269
dc.sourceIIOimport
dc.titleHermetically sealed on-chip packaging of MEMS devices
dc.typeProceedings paper
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage67
dc.source.endpage69
dc.source.conferenceProceedings European Space Components Conference - ESCCON
dc.source.conferencedate21/03/2000
dc.source.conferencelocationNoordwijk The Netherlands
imec.availabilityPublished - open access


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