dc.contributor.author | Simicic, Marko | |
dc.contributor.author | Gijbels, Frank | |
dc.contributor.author | Iacovo, Serena | |
dc.contributor.author | Chen, Shih-Hung | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2024-03-21T14:02:18Z | |
dc.date.available | 2023-11-30T16:47:46Z | |
dc.date.available | 2024-03-21T14:02:18Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0739-5159 | |
dc.identifier.other | WOS:001094864400014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43204.2 | |
dc.source | WOS | |
dc.title | ESD process assessment of 2.5D and 3D bonding technologies | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Simicic, Marko | |
dc.contributor.imecauthor | Gijbels, Frank | |
dc.contributor.imecauthor | Iacovo, Serena | |
dc.contributor.imecauthor | Chen, Shih-Hung | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Simicic, Marko::0000-0002-3623-1842 | |
dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
dc.contributor.orcidimec | Chen, Shih-Hung::0000-0002-6481-2951 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.eisbn | 978-1-58537-347-5 | |
dc.source.numberofpages | 21 | |
dc.source.peerreview | yes | |
dc.source.conference | 45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium | |
dc.source.conferencedate | OCT 02-04, 2023 | |
dc.source.conferencelocation | Riverside | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |