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ESD process assessment of 2.5D and 3D bonding technologies
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Authors
Simicic, Marko
;
Gijbels, Frank
;
Iacovo, Serena
;
Chen, Shih-Hung
;
Van der Plas, Geert
;
Beyne, Eric
EISBN
978-1-58537-347-5
ISSN
0739-5159
Conference
45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium
Journal
N/A
Title
ESD process assessment of 2.5D and 3D bonding technologies
Publication type
Proceedings paper
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2
20.500.12860/43204.2
*
2024-03-21T14:01:30Z
validation by library/open access desk
1
20.500.12860/43204
2023-11-30T16:47:46Z
*Selected version
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