Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding Technologies

Publication:

2023

Journal article

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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

905 since deposited on 2024-01-15

2last month

Acq. date: 2026-02-26