Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Presentations
View item
imec Publications Repository
imec Publications
Presentations
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
Metadata
Show full item record
Authors
Donaton, R. A.
;
Coenegrachts, Bart
;
Maenhoudt, Mireille
;
Pollentier, Ivan
;
Struyf, Herbert
;
Vanhaelemeersch, Serge
;
Grillaert, Joost
;
Fyen, Wim
;
Beyer, Gerald
;
Stucchi, Michele
;
Richard, Emmanuel
;
Vervoort, Iwan
;
De Roest, David
;
Maex, Karen
Conference
Materials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.
Title
Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
Publication type
Oral presentation
Collections
Presentations
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login