Impact of Sub-µm Wafer Thinning on Latch-Up Risk in DTCO/STCO Scaling Era

Publication:

2024

Journal article

Author(s)

;

;

;

;

;

;

IEEE TRANSACTIONS ON ELECTRON DEVICES

604 since deposited on 2024-03-25

2last month

1last week

Acq. date: 2026-08-30