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Cleaning, rinsing and drying effects in post-Cu CMP clean

dc.contributor.authorFyen, Wim
dc.contributor.authorVos, Rita
dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorVrancken, Evi
dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeuris, Marc
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T12:58:46Z
dc.date.available2021-10-14T12:58:46Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4379
dc.sourceIIOimport
dc.titleCleaning, rinsing and drying effects in post-Cu CMP clean
dc.typeProceedings paper
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.beginpage507
dc.source.conferenceProceedings CMP for ULSI Multilevel Interconnection Conference (CMP-MIC); 2-3 March 2000; Santa Clara, Ca, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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