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Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process

dc.contributor.authorGao, Teng
dc.contributor.authorGray, William
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMeynen, Herman
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T12:58:58Z
dc.date.available2021-10-14T12:58:58Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4381
dc.sourceIIOimport
dc.titleIntegration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process
dc.typeProceedings paper
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.contributor.orcidimecStruyf, Herbert::0000-0002-6782-5424
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage33
dc.source.endpage39
dc.source.conferenceAdvanced Metallization Conference 1999 - AMC 1999
dc.source.conferencedate28/09/1999
dc.source.conferencelocationOrlando, FL USA
imec.availabilityPublished - imec


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