dc.contributor.author | Chen, Cong | |
dc.contributor.author | Van den Heuvel, Dieter | |
dc.contributor.author | Beggiato, Matteo | |
dc.contributor.author | Tunca Altintas, Bensu | |
dc.contributor.author | Moussa, Alain | |
dc.contributor.author | Vandooren, Anne | |
dc.contributor.author | Baudemprez, Bart | |
dc.contributor.author | Schobitz, Michael | |
dc.contributor.author | Khaldi, Wassim | |
dc.contributor.author | Bogdanowicz, Janusz | |
dc.contributor.author | Beral, Christophe | |
dc.contributor.author | Charley, Anne-Laure | |
dc.date.accessioned | 2024-04-17T09:22:31Z | |
dc.date.available | 2024-04-17T09:22:31Z | |
dc.date.issued | 2023 | |
dc.identifier.isbn | 978-1-5106-6099-1 | |
dc.identifier.issn | 0277-786X | |
dc.identifier.other | WOS:001022962000037 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43845 | |
dc.source | WOS | |
dc.title | Detection of bonding voids for 3D integration | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Chen, Cong | |
dc.contributor.imecauthor | Van den Heuvel, Dieter | |
dc.contributor.imecauthor | Beggiato, Matteo | |
dc.contributor.imecauthor | Moussa, Alain | |
dc.contributor.imecauthor | Vandooren, Anne | |
dc.contributor.imecauthor | Baudemprez, Bart | |
dc.contributor.imecauthor | Bogdanowicz, Janusz | |
dc.contributor.imecauthor | Beral, Christophe | |
dc.contributor.imecauthor | Charley, Anne-Laure | |
dc.contributor.imecauthor | Tunca Altintas, Bensu | |
dc.contributor.orcidimec | Chen, Cong::0000-0002-6554-7205 | |
dc.contributor.orcidimec | Van den Heuvel, Dieter::0000-0002-4398-1916 | |
dc.contributor.orcidimec | Van Den Heuvel, Dieter::0009-0008-6879-2178 | |
dc.contributor.orcidimec | Beggiato, Matteo::0000-0003-0873-9021 | |
dc.contributor.orcidimec | Moussa, Alain::0000-0002-6377-4199 | |
dc.contributor.orcidimec | Vandooren, Anne::0000-0002-2412-0176 | |
dc.contributor.orcidimec | Bogdanowicz, Janusz::0000-0002-7503-8922 | |
dc.contributor.orcidimec | Beral, Christophe::0000-0003-1356-9186 | |
dc.contributor.orcidimec | Charley, Anne-Laure::0000-0003-4745-0167 | |
dc.contributor.orcidimec | Tunca Altintas, Bensu::0000-0001-8611-3636 | |
dc.date.embargo | 2023-03-31 | |
dc.identifier.doi | 10.1117/12.2657950 | |
dc.identifier.eisbn | 978-1-5106-6100-4 | |
dc.source.numberofpages | 11 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 124961B | |
dc.source.conference | Conference on Metrology, Inspection, and Process Control XXXVII | |
dc.source.conferencedate | FEB 27-MAR 02, 2023 | |
dc.source.conferencelocation | San Jose | |
dc.source.journal | Proceedings of SPIE | |
dc.source.volume | 12496 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | The authors acknowledge imec's Logic and 3D team for valuable input. The authors thank Peter Hoffrogge and Ingo Wiesler from PVA TePla, Dario Alliata from Unity-SC, Gaetano Santoro from Applied Materials, and Andrew Cross and Roel Gronheid from KLA Corporation for discussion. This project was in part supported by IT2 program. | |