Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Presentations
Binary and ternary intermetallics for advanced interconnect metallization
Publication:
Binary and ternary intermetallics for advanced interconnect metallization
Copy permalink
Date
2024-04
Presentation
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
Accepted version
28.37 KB
No license
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Soulie, Jean-Philippe
;
Heylen, Nancy
;
Sankaran, Kiroubanand
;
Scheerder, Jeroen
;
Fleischmann, Claudia
;
Swerts, Johan
;
Tokei, Zsolt
;
Adelmann, Christoph
Journal
Abstract
Description
Metrics
Views
523
since deposited on 2024-05-28
17
last month
2
last week
Acq. date: 2026-01-10
Citations
Metrics
Views
523
since deposited on 2024-05-28
17
last month
2
last week
Acq. date: 2026-01-10
Citations