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dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorBuccheri, Nunzio
dc.contributor.authorLin, Quyang
dc.contributor.authorRoy, Syamashree
dc.contributor.authorPaolillo, Sara
dc.contributor.authorWu, Chen
dc.contributor.authorHermans, Yannick
dc.contributor.authorDecoster, Stefan
dc.contributor.authorBaudemprez, Bart
dc.contributor.authorFinoulst, Jan-Frederik
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2025-03-31T13:56:25Z
dc.date.available2024-06-06T18:30:28Z
dc.date.available2025-03-31T13:56:25Z
dc.date.issued2024
dc.identifier.isbn978-1-5106-7222-2
dc.identifier.issn0277-786X
dc.identifier.otherWOS:001223585400011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43995.2
dc.sourceWOS
dc.titleExtreme UV Self-Aligned Double Patterning process optimization for BEOL interconnections on 3nm nodes and beyond
dc.typeProceedings paper
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorMontero Alvarez, Daniel
dc.contributor.imecauthorBuccheri, Nunzio
dc.contributor.imecauthorLin, Quyang
dc.contributor.imecauthorRoy, Syamashree
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorHermans, Yannick
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorBaudemprez, Bart
dc.contributor.imecauthorFinoulst, Jan-Frederik
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecMontero Alvarez, Daniel::0000-0001-9966-0399
dc.contributor.orcidimecPaolillo, Sara::0000-0003-2798-5228
dc.contributor.orcidimecLin, Quyang::0009-0005-4679-4306
dc.contributor.orcidimecRoy, Syamashree::0009-0009-3247-3252
dc.contributor.orcidimecHermans, Yannick::0000-0002-6973-0795
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecPark, Seongho::0000-0002-1058-9424
dc.identifier.doi10.1117/12.3010454
dc.identifier.eisbn978-1-5106-7223-9
dc.source.numberofpages17
dc.source.peerreviewyes
dc.source.beginpageArt. 129580D
dc.source.conferenceConference on Advanced Etch Technology and Process Integration for Nanopatterning XIII
dc.source.conferencedateFEB 26-29, 2024
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.volume12958
imec.availabilityPublished - imec


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