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Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing

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2011 since deposited on 2021-10-14
1last month
Acq. date: 2026-09-19

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2011 since deposited on 2021-10-14
1last month
Acq. date: 2026-09-19

Citations