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Industrial photonics packaging for high volume applications
Publication:
Industrial photonics packaging for high volume applications
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Date
2024
Proceedings Paper
https://doi.org/10.1117/12.3000934
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Milosevic, Milan M.
;
Tegegne, Zerihun G.
;
Zhong, Chunting
;
van Duinen, David
;
Yin, Xin
;
Bauwelinck, Johan
;
Massaouti, Maria
;
Andrianopoulos, Efstathios
;
Groumas, Panos
;
Theurer, Michael
;
Gupta, Durvasa Y.
;
Kresse, Martin
;
Weigel, Madeleine
;
De Felipe, David
;
Keil, Norbert
;
van Kerkhof, Joost
Journal
Proceedings of SPIE
Abstract
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281
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670
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Downloads
281
since deposited on 2024-06-15
37
last month
9
last week
Acq. date: 2025-12-13
Views
670
since deposited on 2024-06-15
1
last month
1
last week
Acq. date: 2025-12-13
Citations