dc.contributor.author | Milosevic, Milan M. | |
dc.contributor.author | Tegegne, Zerihun G. | |
dc.contributor.author | Zhong, Chunting | |
dc.contributor.author | van Duinen, David | |
dc.contributor.author | Yin, Xin | |
dc.contributor.author | Bauwelinck, Johan | |
dc.contributor.author | Massaouti, Maria | |
dc.contributor.author | Andrianopoulos, Efstathios | |
dc.contributor.author | Groumas, Panos | |
dc.contributor.author | Theurer, Michael | |
dc.contributor.author | Gupta, Durvasa Y. | |
dc.contributor.author | Kresse, Martin | |
dc.contributor.author | Weigel, Madeleine | |
dc.contributor.author | De Felipe, David | |
dc.contributor.author | Keil, Norbert | |
dc.contributor.author | van Kerkhof, Joost | |
dc.date.accessioned | 2024-08-01T14:23:45Z | |
dc.date.available | 2024-06-15T17:25:55Z | |
dc.date.available | 2024-07-31T09:56:30Z | |
dc.date.available | 2024-08-01T14:23:45Z | |
dc.date.issued | 2024 | |
dc.identifier.isbn | 978-1-5106-7044-0 | |
dc.identifier.issn | 0277-786X | |
dc.identifier.other | WOS:001214263700021 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44057.3 | |
dc.source | WOS | |
dc.title | Industrial photonics packaging for high volume applications | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Yin, Xin | |
dc.contributor.imecauthor | Bauwelinck, Johan | |
dc.contributor.orcidimec | Yin, Xin::0000-0002-9672-6652 | |
dc.contributor.orcidimec | Bauwelinck, Johan::0000-0001-5254-2408 | |
dc.date.embargo | 2024-03-11 | |
dc.identifier.doi | 10.1117/12.3000934 | |
dc.identifier.eisbn | 978-1-5106-7045-7 | |
dc.source.numberofpages | 10 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 128920M | |
dc.source.endpage | N/A | |
dc.source.conference | Conference on Optical Interconnects XXIV | |
dc.source.conferencedate | JAN 29-31, 2024 | |
dc.source.conferencelocation | San Francisco | |
dc.source.journal | Proceedings of SPIE | |
dc.source.volume | 12892 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | This work was supported in part by the European Union's Horizon 2020 Research and Innovation Programme through the TERAWAY project (G.A. No 871668), the POETICS project (G.A. No 871769), and the PHOTO-SENS project (G.A. No 965643), which are all an initiative of the Photonics Public Private Partnership. This work was also supported in part by the photonixFAB project which is co-funded by the European Union under grant agreement no. 101111896. The photonixFAB project is supported by the Chips Joint Undertaking and its members, including top-up funding by Belgium, Germany, France, Israel, Italy, and the Netherlands, and it is also supported by Switzerland separately. | |