Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Conference contributions
View item
imec Publications Repository
imec Publications
Conference contributions
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Packaged Cost-Effective Millimeterwave Air-Filled SIW Components for Array Feed Networks
View/
open
Published version (1.358Mb)
Accepted version (896.6Kb)
Metadata
Show full item record
Authors
Van Messem, Laura
;
Moerman, Arno
;
Caytan, Olivier
;
Vande Ginste, Dries
;
Rogier, Hendrik
;
Lemey, Sam
DOI
10.1109/EDAPS58880.2023.10468222
EISBN
979-8-3503-8376-8
ISSN
2151-1225
Conference
IEEE Conference on Electrical Design of Advanced Packaging and Systems (IEEE EPS EDAPS) - Semiconductor Packaging - The Next Frontier
Journal
/
Title
Packaged Cost-Effective Millimeterwave Air-Filled SIW Components for Array Feed Networks
Publication type
Proceedings paper
Embargo date
2023-12-14
Collections
Conference contributions
Version history
Version
Item
Date
Summary
3
20.500.12860/44105.3
*
2024-08-05T07:53:11Z
validation by library/open access desk
2
20.500.12860/44105.2
2024-07-02T08:00:00Z
validation by imec author
1
20.500.12860/44105
2024-06-29T17:02:55Z
*Selected version
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login