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Advanced CMOS manufacturing of superconducting qubits on 300 mm wafers

dc.contributor.authorVan Damme, Jacques
dc.contributor.authorMassar, Shana
dc.contributor.authorAcharya, Rohith
dc.contributor.authorIvanov, Tsvetan
dc.contributor.authorPerez Lozano, Daniel
dc.contributor.authorCanvel, Yann
dc.contributor.authorDemarets, Mael
dc.contributor.authorVangoidsenhoven, Diziana
dc.contributor.authorHermans, Yannick
dc.contributor.authorLai, J. G.
dc.contributor.authorAnanthapadmanabha Rao, Vadiraj
dc.contributor.authorMongillo, Massimo
dc.contributor.authorWan, Danny
dc.contributor.authorDe Boeck, Jo
dc.contributor.authorPotocnik, Anton
dc.contributor.authorDe Greve, Kristiaan
dc.date.accessioned2025-07-09T13:04:42Z
dc.date.available2024-10-12T18:13:36Z
dc.date.available2025-07-09T13:04:42Z
dc.date.issued2024
dc.identifier.issn0028-0836
dc.identifier.otherWOS:001326921400019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44631.2
dc.sourceWOS
dc.titleAdvanced CMOS manufacturing of superconducting qubits on 300 mm wafers
dc.typeJournal article
dc.contributor.imecauthorLai, J. G.
dc.contributor.imecauthorVan Damme, Jacques
dc.contributor.imecauthorMassar, Shana
dc.contributor.imecauthorAcharya, Rohith
dc.contributor.imecauthorIvanov, Tsvetan
dc.contributor.imecauthorPerez Lozano, Daniel
dc.contributor.imecauthorCanvel, Yann
dc.contributor.imecauthorDemarets, Mael
dc.contributor.imecauthorVangoidsenhoven, Diziana
dc.contributor.imecauthorHermans, Yannick
dc.contributor.imecauthorAnanthapadmanabha Rao, Vadiraj
dc.contributor.imecauthorMongillo, Massimo
dc.contributor.imecauthorWan, Danny
dc.contributor.imecauthorDe Boeck, Jo
dc.contributor.imecauthorPotocnik, Anton
dc.contributor.imecauthorDe Greve, Kristiaan
dc.contributor.orcidimecVan Damme, Jacques::0000-0002-8938-4383
dc.contributor.orcidimecMassar, Shana::0000-0002-5329-4677
dc.contributor.orcidimecAcharya, Rohith::0000-0003-3958-6435
dc.contributor.orcidimecIvanov, Tsvetan::0000-0003-3407-2742
dc.contributor.orcidimecPerez Lozano, Daniel::0000-0003-3098-3266
dc.contributor.orcidimecCanvel, Yann::0009-0006-7501-9787
dc.contributor.orcidimecDemarets, Mael::0000-0002-0884-3737
dc.contributor.orcidimecHermans, Yannick::0000-0002-6973-0795
dc.contributor.orcidimecAnanthapadmanabha Rao, Vadiraj::0000-0001-8676-5044
dc.contributor.orcidimecMongillo, Massimo::0000-0002-6475-6320
dc.contributor.orcidimecWan, Danny::0000-0003-4847-3184
dc.contributor.orcidimecDe Boeck, Jo::0000-0001-8244-1552
dc.contributor.orcidimecPotocnik, Anton::0000-0002-0352-6388
dc.contributor.orcidimecDe Greve, Kristiaan::0000-0002-1314-9715
dc.date.embargo2024-09-18
dc.identifier.doi10.1038/s41586-024-07941-9
dc.source.numberofpages13
dc.source.peerreviewyes
dc.source.beginpage74
dc.source.endpage79
dc.source.journalNATURE
dc.identifier.pmidMEDLINE:39294381
dc.source.issue8032
dc.source.volume634
imec.availabilityPublished - open access
dc.description.wosFundingTextWe are grateful for the support of the P-line of Imec, operational support, the Materials and Components Analysis (MCA) team, K. Verhemeldonck for wire-bonding support and F. Loosen for taking pictures. A. Mahbub is acknowledged for supporting the JJ resistance analysis. This work was supported in part by the Imec industrial affiliation programme on quantum computing. J.V.D. acknowledges the support of the Research Foundation-Flanders through the Strategic Basic Research PhD programme (grant no. 1S15722N). We thank O. Painter, J. Bylander, C. Haffner and P. McMahon for insightful comments on this work.


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