Publication:

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Date

2024

Proceedings Paper

https://doi.org/10.1364/ofc.2024.tu3a.4

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Author(s)

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Dvoretskii, Anton

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Golshani, Negin

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Magdziak, Rafal

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Bipul, Swetanshu

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Verheyen, Peter

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Chakrabarti, Maumita

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Velenis, Dimitrios

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Ferraro, Filippo

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Van Campenhout, Joris

Journal

N/A

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337 since deposited on 2024-10-17

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Acq. date: 2026-08-30