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High NA EUV single patterning of advanced metal logic nodes: Inverse lithography techniques in combination with alternative mask absorbers

dc.contributor.authorArmeanu, Ana-Maria
dc.contributor.authorPellens, Nick
dc.contributor.authorPhilipsen, Vicky
dc.contributor.authorMalankin, Evgeny
dc.contributor.authorXu, Dongbo
dc.contributor.authorMizuuchi, Keisuke
dc.contributor.authorCurvacho, Gabriel
dc.contributor.authorWei, Chih-, I
dc.contributor.authorLafferty, Neal
dc.contributor.authorFenger, Germain
dc.date.accessioned2025-06-20T08:42:29Z
dc.date.available2024-11-16T16:49:19Z
dc.date.available2025-06-20T08:42:29Z
dc.date.issued2024
dc.identifier.isbn978-1-5106-8288-7
dc.identifier.issn0277-786X
dc.identifier.otherWOS:001327624200026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44792.2
dc.sourceWOS
dc.titleHigh NA EUV single patterning of advanced metal logic nodes: Inverse lithography techniques in combination with alternative mask absorbers
dc.typeProceedings paper
dc.contributor.imecauthorPellens, Nick
dc.contributor.imecauthorPhilipsen, Vicky
dc.contributor.orcidimecPellens, Nick::0000-0001-5527-5130
dc.contributor.orcidimecPhilipsen, Vicky::0000-0002-2959-432X
dc.identifier.doi10.1117/12.3031718
dc.identifier.eisbn978-1-5106-8289-4
dc.source.numberofpages13
dc.source.peerreviewyes
dc.source.beginpageArt. 132731M
dc.source.endpageN/A
dc.source.conference39th European Mask and Lithography Conference (EMLC)
dc.source.conferencedateJUN 17-19, 2024
dc.source.conferencelocationGrenoble
dc.source.journalProceedings of SPIE
dc.source.volume13273
imec.availabilityPublished - imec
dc.description.wosFundingTextWe would like to thank Peter De Bisschop (imec) for the input layout used in this study and fruitful discussions. Equally, we want to thank Joerg Zimmermann (Zeiss) for source pixelization. This work is partially founded by the European Union by 10ACE (Project: 101139972 -10ACe -HORIZONKDT-JU-2023-1-IA). Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the Chips Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them.


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220.500.12860/44792.2*2025-06-20T08:40:52Zvalidation by library/open access desk
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