Publication:

FI-CDM and LICCDM testing on wafer, single die and package levels

Date

2024

Proceedings Paper

https://doi.org/10.23919/EOS/ESD61719.2024.10702171

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Author(s)

;

Takenaka, Hiroshi

;

Tamura, Shinichi

;

;

;

Sawada, Masanori

;

Chen, Shih-Hung

Journal

N/A

Statistics

154 since deposited on 2024-12-01

Acq. date: 2026-06-26