Publication:

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Date

2024
Proceedings Paper
https://doi.org/10.1109/ectc51529.2024.00123
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Author(s)

Sun, Xiao  
;
Su, Chin-Ya  
;
Chen, Shih-Hung  
;
Chew, Soon Aik  
;
Zhang, Boyao  
;
Beyne, Eric  

Journal

N/A

Abstract

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257 since deposited on 2024-12-07
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Acq. date: 2026-10-13

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