Authors

Lanckmans, Filip; Brongersma, Sywert; Varga, Istvan; Beyne, Eric; Maex, Karen

Conference

MRS Spring Meeting 2000. Symposium D: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics

Title

A quantitative study of the adhesion between copper, barrier and organic low-k polymers

Publication type

Oral presentation