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Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry

dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorMertens, Paul
dc.contributor.authorFyen, Wim
dc.contributor.authorKenis, Karine
dc.contributor.authorMeuris, Marc
dc.contributor.authorNicolosi, T.
dc.contributor.authorBran, M.
dc.contributor.authorFraser, B.
dc.contributor.authorFranklin, C.
dc.contributor.authorWu, Y.
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T13:14:34Z
dc.date.available2021-10-14T13:14:34Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4519
dc.sourceIIOimport
dc.titleSingle wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry
dc.typeProceedings paper
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage157
dc.source.endpage160
dc.source.conferenceProceedings of the 9th International Symposium on Semiconductor Manufacturing - ISSM
dc.source.conferencedate26/09/2000
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - open access


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