Publication:

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESTC60143.2024.10712073

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Author(s)

Hussain, Tassawar

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Derakhshandeh, Jaber

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De Wolf, Ingrid

Journal

N/A

Statistics

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Acq. date: 2026-05-18