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dc.contributor.authorDoppelbauer, David
dc.contributor.authorFloetgen, Christoph
dc.contributor.authorGabas, Ignacio Gabriel Vicente
dc.contributor.authorIacovo, Serena
dc.contributor.authorBrems, Steven
dc.contributor.authorBeyne, Eric
dc.contributor.authorDuchoslav, Jiri
dc.contributor.authorGroiss, Heiko
dc.date.accessioned2025-04-16T08:42:22Z
dc.date.available2025-03-06T20:45:28Z
dc.date.available2025-04-16T08:42:22Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001411360600034
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45317.2
dc.sourceWOS
dc.titleCharacterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding
dc.typeProceedings paper
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/IITC61274.2024.10732483
dc.identifier.eisbn979-8-3503-8517-5
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedateJUN 03-06, 2024
dc.source.conferencelocationSan Jose
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThe financial support by the Austrian Federal Ministry of Labour and Economy, the National Foundation for Research, Technology and Development and the Christian Doppler Research Association is gratefully acknowledged.


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