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Integration of electroless and electrolytic Cu and IC back end of line technologies

dc.contributor.authorMaex, Karen
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorLantasov, Yuri
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorPalmans, Roger
dc.contributor.authorVervoort, Iwan
dc.date.accessioned2021-10-14T13:18:46Z
dc.date.available2021-10-14T13:18:46Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4551
dc.sourceIIOimport
dc.titleIntegration of electroless and electrolytic Cu and IC back end of line technologies
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage71
dc.source.endpage79
dc.source.conferenceElectrochemical Technology Applications in Electronics III
dc.source.conferencedate17/10/1999
dc.source.conferencelocationHonolulu, HI USA
imec.availabilityPublished - imec
imec.internalnotesElectrochemical Society Proceedings; Vol. 99-34


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