Publication:

3D metrology and inspection to enable the rise of stacked transistors, wafers and chips

Date

2025
Proceedings Paper
https://doi.org/10.1117/12.3052399
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Author(s)

Bogdanowicz, Janusz  
;
Charley, Anne-Laure  
;
Leray, Philippe  
;
Liu, Ru-Gun  

Journal

Proceedings of SPIE

Abstract

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72 since deposited on 2025-07-28
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Acq. date: 2026-07-20

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