Publication:

Cu Pad Height Evaluation Technique Using Four-Directional BSE Signal of SEM for Hybrid Bonding Applications

Date

2025

Proceedings Paper

https://doi.org/10.1117/12.3051014

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Author(s)

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Hasumi, Kazuhisa

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Tunca Altintas, Bensu

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Bogdanowicz, Janusz

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Charley, Anne-Laure

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Journal

Proceedings of SPIE

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56 since deposited on 2025-07-28

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Acq. date: 2026-05-19