Publication:

Cu Pad Height Evaluation Technique Using Four-Directional BSE Signal of SEM for Hybrid Bonding Applications

Date

2025
Proceedings Paper
https://doi.org/10.1117/12.3051014
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Author(s)

Kasai, Hiroaki
;
Doi, Yuki
;
Osaki, Mayuka
;
Hasumi, Kazuhisa
;
Mise, Nobuyuki
;
Tanaka, Maki
;
Chew, Soon Aik  
;
Tunca Altintas, Bensu  
;
Bogdanowicz, Janusz  
;
Moussa, Alain  
;
Saib, Mohamed  
;
Zhang, Boyao  
;
Charley, Anne-Laure  
;
Lorusso, Gian  

Journal

Proceedings of SPIE

Abstract

Description

Statistics

Views

62 since deposited on 2025-07-28
4last month
2last week
Acq. date: 2026-09-16

Citations

Statistics

Views

62 since deposited on 2025-07-28
4last month
2last week
Acq. date: 2026-09-16

Citations