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Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density
Publication:
Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density
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Date
2025-NOV 15
Journal article
https://doi.org/10.1016/j.mee.2025.112384
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanstreels, Kris
;
Okudur, Oguzhan Orkut
;
Gonzalez, Mario
;
Beyne, Eric
Journal
MICROELECTRONIC ENGINEERING
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40
since deposited on 2025-08-09
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Acq. date: 2026-01-09
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Views
40
since deposited on 2025-08-09
12
last month
2
last week
Acq. date: 2026-01-09
Citations