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Roles of additives during filling process of damascene structures with electrochemical deposited copper
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Authors
Richard, Emmanuel
;
Vervoort, Iwan
;
Brongersma, Sywert
;
Bender, Hugo
;
Beyer, Gerald
;
Palmans, Roger
;
Lagrange, Sébastien
;
Maex, Karen
Conference
Advanced Metallization Conference 1999 - AMC 1999
Title
Roles of additives during filling process of damascene structures with electrochemical deposited copper
Publication type
Proceedings paper
Embargo date
9999-12-31
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