Publication:

Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization

Date

2000
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Author(s)

Satta, Alessandra
;
Beyer, Gerald  
;
Maex, Karen  
;
Elers, K.
;
Haukka, S.
;
Vantomme, Andre  

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2031 since deposited on 2021-10-14
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2031 since deposited on 2021-10-14
Acq. date: 2026-02-24

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