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CIMID, a technology for high density integration of electronic systems

dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorRoggen, Jean
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeermann, M.
dc.contributor.authorGouwy, G.
dc.contributor.authorBulcke, F.
dc.date.accessioned2021-09-29T12:39:51Z
dc.date.available2021-09-29T12:39:51Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/48
dc.sourceIIOimport
dc.titleCIMID, a technology for high density integration of electronic systems
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceWorkshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies
dc.source.conferencedate08/06/1994
dc.source.conferencelocationWindsor UK
imec.availabilityPublished - open access


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